Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

CEO Jensen Huang confirmed its advanced packaging needs from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) are changing, according to a report by Reuters. Blackwell, Nvidia's latest artificial ...

TAICHUNG, Taiwan, Jan 16 (Reuters) - Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang ...

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

Nvidia Corp CEO Jensen Huang (黃仁勳) is expected to miss the inauguration of US president-elect Donald Trump on Monday, bucking ...

Nvidia Corp’s demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) remains strong though the kind of technology it needs is changing, Nvidia CEO Jensen Huang (黃仁勳) said ...