By containing the sound wave on the surface of a chip, it can more easily interact with the environment, making it a perfect candidate for advanced sensing technologies.

To understand this, they included data from multiple wave sources along the fault line in their model, assuming that some parts of the fault generated waves about 30 seconds after the initial rupture.

Scientists have successfully used sound waves to levitate and manipulate multiple objects simultaneously for the first time, using the system to “sew” a thread into a piece of fabric.

“We can use the sound waves to apply just the right amount of pressure in the right places to the stem cells, to trigger the change process,” said Leslie Yeo, co-lead researcher on the study.