Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.

Changing its Blackwell architectural plan, Nvidia ( NVDA, Financials) is reordering its product line and supply chain focus.

TSMC (TSM.US)’s CoWoS is rumored to have faced order cuts and slackened production expansion, according to multiple media ...

Nvidia's ( NASDAQ: NVDA) latest Blackwell lineup suggests it will reduce demand for CoWoS-S from Taiwan Semiconductor Manufacturing Company ( NYSE: TSM) for at least the next year based on design ...

An Nvidia Blackwell B100/B200 GPU consists of two compute chiplets packing 104 billion transistors alongside eight HBM3E ...

with the CoWoS-L product line increasing by 470% per annum as the main driving force. Taiwan’s equipment supply chain, including wet etching, dispensing, crystal picking, and other key process ...

The Blackwell chip faces production setbacks, including yield issues with TSMC's 4nm process, challenges with CoWoS-L packaging, and thermal design flaws. While some issues are being resolved ...

built on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS®) advanced packaging technology. LONDON & TORONTO, September 26, 2024--Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and ...

However, as a new product, Blackwell still faces considerable production challenges. Media reports indicate that Blackwell utilizes TSMC’s CoWoS-L packaging technology, which has its own yield issues.