Summary Liquid cooling is becoming more popular in data centers due to rising power densities and heat generation, making air cooling less efficient. While complex to implement, tools like Cadence ...

D Packaging in Semiconductors Increased Trend for of Electric Devices Drives Demand: Summary The global 3D semiconductor packaging market, valued at $11 billion in 2023, is proje ...

TSMC bullish on outlook as AI boom blows Q3 profit past forecasts: Summary TSMC, the world’s largest contract chipmaker, posted a 54% profit jump, driven by soaring AI chip dema ...

Intel faces headwinds in China as trade body calls for security probe: Summary China’s Cybersecurity Association has called for a security review of Intel products, citing natio ...

Key lawmakers push to cut off Huawei suppliers from US chip gear: Summary Key US lawmakers are urging the Biden administration to block Huawei suppliers from accessing American ch ...