Semiconductor Packaging News
Production will start by the end of 2024. AMD hopes to capture market share in the booming AI sector, which could challenge Nvidia's dominance. Vietnam's bold semiconductor strategy targets the establishment of three production facilities, 20 …
Semiconductor Packaging News
The semiconductor industry is crucial for global growth sectors like AI, cloud computing, and defense. In response, the EU and U.S. have enacted "chips acts" to boost domestic production, aiming for semiconductor sovereignty by 2030 amid geopolitical tensions and market challenges. EE Times Europe. Chipzilla back on death row.
Semiconductor Packaging News Technical Paper Index
Jul 31, 2024. Advanced Packaging for Next-Generation Vehicle. Automotive processors are swiftly adopting advanced semiconductor technologies, including 5 nm and 3 nm processes. This shift necessitates advanced packaging ... Amkor Technology, Inc.
Is Chip Packaging the New Front on the US-China CHIP WARS?
Scott Foster's Asia Times article emphasizes that advanced IC packaging is the new battleground in the U.S.-China chip wars. While U.S. sanctions target IC production, China's stronghold on back-end packaging complicates restriction efforts. The dedicated team at Semiconductor Packaging News has provided this summary for your convenience.
TSMC OIP 2024: Strong Partnerships Drive 3D Packaging
3 days ago · TSMC OIP 2024: Strong Partnerships Drive 3D Packaging. Summary At the TSMC North America OIP Ecosystem Forum, advanced packaging technologies dominated, outshining gate-all-around transistors. TSMC’s OIP drives collaboration, optimizing 3D packaging and chiplet design to streamline integration and reinforce their market leadership position ...
CHIPS Subsidy Boosts Advanced Packaging in U.S.
CHIPS Subsidy Boosts Advanced Packaging in U.S. Summary A $1.6 billion CHIPS Act subsidy aims to boost U.S. advanced-packaging capacity. Taiwan's ASE and others double California capacity to support AMD, Apple, and Nvidia. The U.S. Department of Commerce launches a competition to spur R&D in energy-efficient tech. EE TimesRead the Full ...
New semiconductor factories are rising in US, but billions in Chips …
New semiconductor factories are rising in US, but billions in Chips Act money has yet to flow: Summary Several new semiconductor factories are sprouting up in the United States as billions of dollars from the CHIPS Act remain untapped.
Metrology Advances Step Up To Sub-2nm Device Node Needs
2 days ago · Metrology Advances Step Up To Sub-2nm Device Node Needs. Summary Metrology and inspection face new challenges as semiconductor features shrink to 2nm and below. Suppliers must innovate ahead of demand, while fabs integrate advanced analytics for precision. Hidden defects in 3D structures require new tools for improved yield and efficiency.
Chip Industry Week In Review
4 days ago · Chip Industry Week In Review. Summary Imec launched a new automotive chiplet consortium to explore optimal architectures and packaging for automotive applications. The U.S. may need to triple its nuclear capacity by 2050, while Foxconn builds an AI server fab in Mexico to support NVIDIA. GlobalWafers expands production globally.
Intel Glass Core Substrate Update - Semiconductor Packaging News
Intel Glass Core Substrate Update. INEMI hosted a webinar spotlighting Glass Substrates for Advanced Packaging, showcasing Intel's pioneering work. Dr. Dilan Seneviratne and Dr. Gang Duan of Intel detailed the company's strategic focus on glass core substrates, integral to their Advanced Packaging roadmap unveiled in September 2023.